26 Layers Routing Depth Controlled Board
This 26-layer high-precision depth-controlled routing PCB features a finished board thickness of 2.8mm and is manufactured with high-reliability TUC TU-872SLK substrate. Adopting a professional process of through-hole conduction + high-precision depth-controlled stepped groove routing, it undergoes full-board gold plating plus secondary independent gold plating for stepped grooves. Custom-developed for special structural installation and height-difference assembly requirements of high-end communication mainboards, it solves common defects of traditional PCBs such as incompatible special-shaped assembly, poor local conduction and easy oxidation of stepped positions. With high-density multi-layer routing capability, accurate structural tolerance and excellent oxidation resistance, it is a high-matching precision PCB solution for premium communication mainboards.
Description
Core Specifications
- Layers: 26 Layers
- Finished Board Thickness: 2.8mm
- Material: TUC TU-872SLK industrial high-reliability substrate, featuring excellent heat resistance and high dimensional stability, suitable for multi-layer thick board lamination
- Core Process: Through-hole conduction + high-precision depth-controlled stepped groove routing with controllable depth tolerance and smooth flatness
- Surface Treatment: Full-board gold plating + secondary independent gold plating for stepped grooves, effectively improving solderability and oxidation resistance of the board and groove contact surfaces
Core Advantages
- High-precision Depth-controlled Routing for Special Assembly: Adopting professional depth-controlled routing molding technology, the stepped grooves deliver accurate depth and flatness with burr-free smooth groove walls. It perfectly fits special-shaped components and height-difference plug-in modules of communication mainboards, avoiding assembly interference and poor fitting, and providing superior structural compatibility compared with ordinary PCBs.
- Dual Gold Plating Process for Higher Stability: Different from conventional single-sided gold plating, the dual gold plating process for both the full board and stepped grooves ensures outstanding conductivity, wear resistance and oxidation resistance of groove contact positions. It prevents oxidation and poor contact during long-term plugging and high-frequency operation, greatly improving the overall equipment stability.
- Premium TUC Substrate for High Mass Yield: TUC TU-872SLK substrate features high Tg, low thermal expansion, excellent moisture and aging resistance. It avoids delamination, bubbling and deformation during multiple lamination processes for 26-layer boards, ensuring high dimensional accuracy and stable electrical performance to adapt to long-term continuous operation of communication equipment.
- Composite Structure with High Integration: The through-hole structure ensures integral electrical conduction, while the depth-controlled stepped grooves meet special structural assembly and local functional requirements. The integrated board realizes high-density routing and special-shaped installation without secondary processing, simplifying the overall equipment structure and reducing assembly costs.
Application Fields
Widely applied in high-end communication mainboards, communication switching mainboards, network equipment core mainboards, precision communication module carrier boards and other premium communication devices.
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