22-Layer Mixed-Laminate PCB With Buried Via & 2nd Order HDI
Customized for 5G communication switch mainboards, this 22-layer high-complexity PCB adopts mixed lamination stack-up with Isola 185HR (RTF) high-speed substrate and Tachyon 100G ultra-low-loss high-frequency material. Combined with buried vias & 2nd-order HDI stacked microvia technology, it balances ultra-dense routing, superior signal integrity and mechanical rigidity. Ideal for mass data transmission, multi-chip dense packaging and high-power heat dissipation of 5G switches, supporting stable 100G high-speed signal transmission with long-term reliability.
Description
Core Specifications
- Layers: 22 Layers
- Finished Board Thickness: 3.25mm
- Materials: Isola 185HR (RTF) + Tachyon 100G low-loss laminate
- Interconnection Tech: Buried Via + 2nd Order HDI Stacked Microvia
Key Advantages
- Dual-performance mixed substrate: Isola 185HR (RTF) delivers high thermal resistance and low thermal expansion for multi-lamination stability; Tachyon 100G features ultra-low Dk/Df to minimize signal loss up to 100GHz.
- 2nd-order HDI + buried via structure: Greatly improves wiring density to support high-pin-count BGA layout of switch chips.
- 22-layer thick stack-up: Complete power & ground planes for high-current power supply and effective EMI shielding.
- Industrial-grade reliability: Resists thermal cycling and humidity, stable for 7/24 continuous operation in data center.
Application
5G core switch mainboard, 100G high-speed switching equipment, data center server backplane, 5G bearer network control board
Hot Tags: 22-layer mixed-laminate pcb with buried via & 2nd order hdi, China 22-layer mixed-laminate pcb with buried via & 2nd order hdi manufacturers, suppliers, factory, 20 Multi Layer PCB, 20Layer Printed Circuit Board, 24 Multi Layer PCB, 48Layer Printed Circuit Board, 80Layer ATE Tester PCB Board, Multilayer mechanical blind hole board
Send Inquiry
You Might Also Like
