42 Layers Back Drilling Board
This 42-layer high-precision back drill PCB has a finished board thickness of 6.75mm, fabricated with composite high-end TU-933 + HVLP4 substrates. Customized for high-speed signal transmission scenarios of 5G communication backplanes, it features 17 types of precision back drill processes with a controlled depth of 150±50μm. It effectively removes via stub residues to greatly reduce high-speed signal transmission loss and crosstalk interference. With an ultra-high-layer stack-up, precise back drill technology and high-performance composite materials, the PCB delivers excellent signal integrity, superior structural stability and outstanding high-frequency performance, fully meeting the high-capacity, high-speed and high-stability signal transmission requirements of 5G communication backplanes.
Description
Core Specifications
- Layers: 42 Layers
- Finished Board Thickness: 6.75mm
- Core Process: 17 types of precision back drill technology with a depth tolerance of 150±50μm, adapting to complex circuit design with diverse hole specifications
- Material: TU-933 + HVLP4 composite high-frequency substrate, combining high structural strength and ultra-low high-frequency loss, suitable for lamination of ultra-high-layer thick boards
- Application: 5G high-speed communication backplanes, core communication transmission backplanes and other high-precision communication equipment
Core Advantages
- Multi-specification Precision Back Drill for Optimized Signal Integrity: Supporting 17 differentiated back drill specifications with precise depth control at 150±50μm, the process thoroughly eliminates via stubs and reduces signal reflection, attenuation and crosstalk. It solves common industrial pain points such as signal distortion and delay in 5G high-frequency and high-speed transmission, ensuring stable high-speed data transmission and adapting to complex multi-channel communication circuit layout.
- 42-Layer Ultra-thick Stack-up with Strong Load Capacity: The 42-layer high-precision stack-up and 6.75mm thick board adopt well-structured partitioned power, ground and signal layers, enabling independent multi-channel signal transmission and stable high-current power supply with excellent EMI shielding performance. Adopting precision multi-lamination technology to control warpage and deformation, the board features high assembly fitting degree and stable electrical performance without drift during long-term operation.
- High-performance Composite Substrate for Superior High-frequency Adaptability: The professional communication-grade TU-933 + HVLP4 composite material features low Dk and low Df for ultra-low high-frequency signal loss, as well as high heat resistance, low thermal expansion, aging resistance and moisture resistance. It avoids delamination, bubbling and other defects during repeated lamination of ultra-high-layer boards, ensuring high mass yield and supporting 7×24-hour continuous operation of communication equipment.
- Multi-process Compatibility for High-end Customization: The 17-specification back drill process flexibly adapts to various complex backplane circuit designs, compatible with dense layout of various chips and assembly of high-speed transmission modules. No secondary processing is required, which simplifies the overall equipment structure and effectively improves the integration and long-term operation stability of 5G communication backplanes.
Application Fields
Widely used in 5G core communication backplanes, 5G base station transmission backplanes, high-end network communication backplanes, high-speed data exchange and transmission backplanes and other precision 5G communication equipment.
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