100Layer ATE Tester PCB Board

100Layer ATE Tester PCB Board

The 100-layer ATE Test PCB is an ultra-high-layer, high-precision specialized test circuit board, custom-designed for Automatic Test Equipment (ATE). This product is used in the semiconductor packaging and testing process to perform functional and performance testing on integrated circuits, ensuring stable and reliable chip quality.
With its extremely high layer count and complex interconnect structure, this PCB offers excellent signal integrity, interlayer reliability, and mechanical stability—fully meeting the demanding requirements of high-end chip testing for high-density routing and high-speed signal transmission.
It is ideally suited for large-scale automated testing in applications such as high-end SoCs, memory, and AI chips. We offer customized structures, materials, and electrical performance options to meet the specific needs of different customers.

Description

100-Layer ATE Tester PCB Board

 

Next-Level Innovation for Advanced Semiconductor Testing

At First Quality Circuit, we push the boundaries of what's possible in PCB manufacturing. Our 100-layer ATE Tester PCB Board represents a new frontier in high-density, high-performance circuit board engineering, designed specifically for cutting-edge semiconductor testing applications.

 

Engineered for Complexity

This board isn't just another multilayer PCB - it's a precision-crafted testing backbone built to handle the most advanced integrated circuits on the market. With 100 functional layers, it supports ultra-complex signal routing, multi-network test environments, and the stringent performance standards of modern ATE systems.

 

Built for Speed and Stability

As semiconductor devices become faster and more compact, test equipment must keep up. The 100-layer ATE board enables high-speed signal transmission with controlled impedance pathways, minimal crosstalk, and robust structural integrity, even under continuous operation. Its design ensures consistent test accuracy in even the most demanding test benches.

 

Designed for the Future of IC Testing

This board supports a wide range of chip types, from next-gen SoCs and AI processors to advanced memory components. Whether you're testing high-bandwidth devices or fine-pitch interconnects, our board is ready to deliver the signal fidelity and mechanical stability your system needs.

 

High Layer Count, High Customizability

We offer complete flexibility in stack-up configuration, dielectric materials, via structures (including microvias, blind/buried vias), and surface finishes. Need high-Tg materials or tailored impedance profiles? Our engineering team works closely with customers to adapt every detail for their unique testing goals.

 

Scalable Production, Global Reach

Backed by advanced manufacturing lines and rigorous process control, we can support both prototype and high-volume production. Our international support team ensures timely delivery, technical assistance, and seamless integration into your test workflows-no matter where your operations are located.

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