HDI circuit board

Our company is capable of producing 1st to 5th-order HDI boards, supporting any-layer interconnect structures with up to 16 layers. The minimum laser via diameter is 0.075 mm, with a depth range of 0.05 mm to 0.12 mm, making it suitable for high-density and miniaturized product design requirements.

Utilizing laser drilling and sequential lamination technology, we ensure stable connections for blind and buried vias. Multiple surface finishes are supported, including ENIG (electroless nickel immersion gold), immersion silver, and OSP (organic solderability preservative), and the process is compatible with high-frequency and high-speed materials.

Main Application Areas:
Communication equipment (e.g., 5G modules, RF antennas)
Industrial control systems (e.g., PLCs, industrial computers)
Medical electronics (e.g., patient monitors, diagnostic imaging devices)

We are committed to providing customers with high-reliability and high-performance HDI PCB solutions to meet the stringent demands of the communication, industrial control, and medical sectors.

Rigid Flex Board

Our company possesses mature manufacturing capabilities for rigid-flex PCBs, with structures ranging from 6 to 20 layers. We support a wide variety of configurations, including 1st to 5th-order HDI, any-layer interconnects, asymmetric structures, and multi-FPC partition designs, meeting the complex design demands of high density, thin and lightweight form factors, and 3D assembly.

Typical Products Include:
6-layer any-layer rigid-flex PCB
8-layer any-layer or 2nd-order HDI rigid-flex PCB
8-layer rigid PCB combined with multiple FPCs (2–3 pieces)
12-layer structure with EMI shielding film and hard gold surface finish
20-layer 5th-order HDI rigid-flex PCB

Manufacturing Features:
High reliability integration of multi-order HDI and FPC segments
Supports surface finishes such as hard gold, ENIG, and ENEPIG
Special processes including EMI shielding film, stiffeners, and laser window openings
Excellent bending resistance in flexible areas, with minimum line width/spacing of 50μm
One-step lamination for dimensional stability and compatibility with precision assembly

Application Areas:
Widely used in fields with stringent requirements for miniaturization and high reliability, such as communication modules, industrial control, medical equipment, camera modules, and wearable devices.

Heavy Copper board & IMS

Our company has established mature manufacturing capabilities for thick copper and metal core PCBs, widely used in high-current and high-power heat dissipation applications such as power modules, new energy systems, automotive electronics, and industrial control.

Product Capabilities:
Copper thickness range: 3oz to 15oz (UL certified: up to 15oz for 2-layer boards, up to 13oz for multilayer boards)
Board structures: metal core sandwich, metal-backed substrate, pure copper core, embedded copper block structure
Special processes: embedded copper blocks, copper posts, localized copper thickening, thermal relief window design
Supported materials: aluminum base, copper base, stainless steel, FR4 hybrid lamination

Process Advantages:
High-reliability copper etching and plating processes ensure strong conductivity and high current-carrying capacity
Precise copper thickness uniformity control to optimize current paths and heat distribution
Metal core boards offer fast heat dissipation and low thermal expansion, ideal for harsh environments
Optional die-cast aluminum structures and V-CUT slot designs simplify structure and ease installation

Typical Applications:
Industrial power supplies, motor controllers, high-power LED drivers
New energy vehicle BMS / charging modules
High-power laser control boards for medical equipment
Communication RF power amplifier modules, base station power supply systems
We offer customized solutions including copper thickness design, thermal simulation, and structural recommendations to help customers achieve high reliability and long service life in their products.

Flexible Printed Circuit board

Our company manufactures 1–2 layer flexible printed circuits, widely used in electronic products that require space-saving, dynamic bending, and high reliability. These FPCs are suitable for applications in communications, consumer electronics, medical devices, industrial control, and more.

Core Capabilities:
Layers: 1–2 layers, customizable for single- or double-sided designs
Materials: High-reliability PI (polyimide) base material, offering excellent flexibility and heat resistance
Thickness Range: 0.05 mm to 0.3 mm, ultra-thin design suitable for high-density assembly
Minimum Line Width/Spacing: 50μm / 50μm, ideal for high-precision routing
Processing Options: Laser cutouts, solder mask coverlay, stainless steel/PI stiffeners, adhesive backing, etc.
Surface Finishes: ENIG, immersion silver, OSP, carbon ink, ENEPIG (nickel-palladium-gold)


Structural Features & Advantages:
Bendable and foldable, ideal for dynamic or repetitive motion applications
Space-efficient, reduces interconnect points, and improves system reliability
Compatible with modular designs and can integrate with rigid boards for multi-dimensional layouts
Supports FPC + SMT integrated processing for enhanced production efficiency

Application Areas:
Wearable devices (e.g., smartwatches, health patches)
Camera modules, antenna flex boards, display connector cables
Medical probes, disposable diagnostic modules
Communication modules, dynamic connectors for drones/robots

We provide customized flexible layout solutions tailored to product shapes and electrical requirements, supporting small-batch prototyping with fast turnaround and seamless transition to mass production.

High Frequency Board

Our company has extensive experience in manufacturing high-frequency and high-speed PCBs, widely used in applications with stringent signal integrity requirements such as RF communication, 5G base stations, radar systems, data centers, and high-speed interconnect modules.

Key Manufacturing Capabilities:
Supported Frequency Range: 1GHz to 40GHz for high-frequency signal applications
Material Systems: Skilled in processing high-frequency/high-speed materials such as Rogers, Taconic, Panasonic Megtron 6, ITEQ, TUC, and TUC TU-872, with support for hybrid lamination structures (e.g., FR4 combined with high-frequency materials)
Layer Count: From 2 layers up to 100 layers, supporting complex high-frequency and HDI designs
Impedance Control: Precision impedance control within ±5% tolerance
Surface Finishes: ENIG, ENEPIG, OSP, immersion silver — all optimized for high-speed signal transmission
Processing Capability: Minimum line width/spacing of 50μm / 50μm; mature processing of microstrip, stripline, and other high-speed routing structures

Process Features & Advantages:
Precision stack-up design ensures short signal paths and low crosstalk
Tight control of board thickness, dielectric constant, and CTE (coefficient of thermal expansion) matching during fabrication
Optical alignment system for inner layers enhances registration accuracy in complex multilayer builds
Hybrid lamination (high-frequency + FR4) offers an optimal balance of performance and cost
Supports high-speed differential pair design, low-loss material testing, and stack-up simulation services

Typical Application Areas:
5G communication equipment / RF front-end modules / microwave antenna arrays
High-speed networking devices (e.g., switches, routers, servers)
Radar systems / aerospace / autonomous driving mmWave radar
Medical imaging / high-frequency sensing systems / industrial Ethernet communication modules


We assist customers with high-speed signal routing design, impedance calculation, material selection, and stack-up optimization — ensuring the best possible balance between performance, cost, and delivery.