40 Layers Testing Machine Board
This 40-layer ultra-high-layer PCB is specially developed for high-end test equipment, with a finished board thickness of 6.35mm. Made of SHENGYI S1190 high-reliability substrate, it is a high-precision circuit board featuring ultra-high layer count, ultra-high aspect ratio and ultra-fine circuit technology. Breaking conventional PCB process limits, it achieves a super high board-to-hole aspect ratio of 16:1 and ultra-fine circuit width/spacing of 0.1mm/0.13mm. Featuring multi-layer structure, thick board body, high wiring density, stable conduction, high voltage resistance and excellent consistency, it meets the stringent requirements of multi-channel signal acquisition, precise impedance testing and high-density module integration for high-end testing equipment, serving as the core mainboard for various precision testing and inspection devices.
Description
Core Specifications
- Layers: 40 Layers
- Finished Board Thickness: 6.35mm
- Board-to-Hole Aspect Ratio: 16:1 ultra-high aspect ratio, suitable for precision deep hole conduction process of thick boards
- Line Width/Spacing: 0.1mm/0.13mm ultra-fine precision circuit, greatly improving board wiring density
- Material: SHENGYI S1190 high-end flame-retardant substrate with high Tg, excellent heat resistance and low deformation, suitable for multiple lamination processes of ultra-high-layer PCBs
Core Advantages
- Ultra-high-layer Thick Board Structure with Strong Integration: The 40-layer stack-up and 6.35mm thick board realize zoned layout of multiple ground layers, power layers and signal layers, supporting multiple independent signal channels and high-current power supply. It perfectly meets the multi-point, multi-channel and high-precision synchronous testing requirements of test equipment, replacing traditional multi-board splicing structures and significantly improving equipment stability.
- 16:1 Ultra-high Aspect Ratio for Stable Deep Hole Conduction: Adopting precision drilling and copper deposition electroplating technology to solve the conduction difficulties of thick-board deep holes. The hole walls feature uniform plating without voids or fractures, ensuring consistent electrical conduction of all vias and avoiding test data deviation and detection failure caused by poor via conduction.
- Ultra-fine Circuit for Higher Wiring Density: The precision process of 0.1mm line width and 0.13mm line spacing maximizes circuit capacity within limited board area. It adapts to dense wiring requirements of highly integrated test chips and precision detection modules, ensuring high-precision micro-signal transmission and weak signal acquisition with outstanding anti-interference performance.
- Premium Substrate for Superior Working Stability: SHENGYI S1190 industrial-grade substrate delivers excellent heat resistance, moisture resistance and dimensional stability. It effectively prevents delamination, bubbling and warping during repeated lamination of ultra-high-layer boards, maintaining highly consistent electrical parameters. It supports long-term stable operation under high-frequency working conditions such as precision testing and repeated power-on detection, improving product durability and testing accuracy.
Application Fields
Widely applied in high-end automatic test equipment, precision detection equipment, chip test equipment, industrial control test mainboards, precision instrument test control systems and other precision testing scenarios.
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