Six Stages Laser Drilling Pcb

Six stages laser drilling pcb refers to a printed circuit board that needs to be pressed 6 times and has a laser drilling process.

Laser drilling is an efficient drilling method that can be applied to many different industries. By using laser technology to complete the drilling work of printed circuit boards, higher drilling accuracy, smaller aperture, faster operation speed can be achieved, and problems such as vibration and debris generation in traditional mechanical drilling can be avoided.

The 6-stage laser drilling printed circuit board is widely used in electronic products, such as high-tech products such as mobile phones, computers, and digital cameras. This board has the advantages of small aperture, compact circuit layout, and low resistivity, which can make the printed circuit board smoother and signal transmission more stable. In addition, due to the relatively small wiring space on the board, the miniaturization design of the printed circuit board can be better achieved to meet the demand of the mass market for small size and multiple functions.

Laser drilling requires the following steps: first, designing the printed circuit board. This step requires the use of CAD software to draw the specific shape, layout, and drilling position of the pcb based on the circuit diagram and layout requirements. Then there is graphic output, creating control files for drilling holes to facilitate controlling the direction of beam movement and drilling depth during laser drilling. The next step is the process of laser drilling, which requires the use of a laser drilling machine. This machine can accurately drilling holes for different apertures and material types, and generally requires manual preprocessing and inspection of the holes in each layer. Finally, the forming process of the board requires copper winding and surface treatment of the multi-layer board at high temperatures to make it into a finished product.

The 6-stage laser drilling board is also equipped with a professional laser level, which can effectively assist users in horizontal alignment and improve the accuracy of laser drilling. At the same time, the laser level of this drilling board also has a certain automatic adjustment function. When the substrate is not completely horizontal, it will automatically prompt the user to make adjustments, ensuring the accuracy of drilling.

Laser drilling is a high precision pcb drilling technology, which uses a laser beam instead of the traditional mechanical drill bits to drill. Laser drilling can drill a very small aperture, and the hole quality is high, the hole wall is smooth, no residual burr, and can perfectly adapt to the development needs of modern electronic products miniaturization and high-density components.

Difficulties

In laser drilling, beam positioning system is very important for the accuracy of aperture forming. Although the beam positioning system is used for accurate positioning, the hole position accuracy is often affected by other factors.

The difficulty of the 6-stage laser drilling board lies in the high accuracy requirements for drilling. Due to the complexity of the circuit of this type of board, multiple drilling processes with smaller apertures are required. If the drilling is not accurate, it will cause the entire circuits to be blocked.

Due to the need for multiple presses on the 6-stage laser drilling board, the substrate may experience fluctuations due to factors such as humidity and temperature, which can easily cause hole displacement and inaccurate hole alignment accuracy.

The size and position of the etched opening window can cause errors.

The 6-stage laser drilling board is a highly challenging printed circuit board that requires strict control over all production processes. After trial production, Sihui Fuji has mastered the production technology of this type of printed circuit board and is capable of mass production and timely delivery.

Picture：Six stages laser drilling pcb

The specification of sample board

Item:Six stages laser drilling pcb

Material:EM-370(Z)

Layer:14

Board thickness:1.6±0.16mm

Surface treatment:ENIG

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