Stacked Micro Via Pcb

Stacked micro via pcb is a special type of board, which is more complex than ordinary printed circuit boards. In a stacked micro via pcb, there are two or more circuit layers that are connected by stacking them together. The hole is an advanced technology used in the PCB manufacturing process, which can ensure the thickness of the printed circuit board while adding more circuit layers. This technology is usually used in high-speed, high-density printed circuit board design because it can achieve better electrical performance.

With the development of electronic products towards thin and short, the demand for product refinement is also increasing. In the production of printed circuit boards, in addition to reducing the aperture of the through hole, reducing the size of the circuit is also an important direction to improve product density and reduce the size of the completed board. There are two main problems in the process of making boards: 1. the production of fine circuits; 2. Reliable interconnection between layers.

For fine circuit manufacturing, the reduction method is the traditional and most widely used mature process, but its ability to process fine lines is limited. The full addition method is suitable for producing fine circuits, but it is costly and the process is not yet mature. Although the semi additive method can process fine circuits, it also has the disadvantage of poor adhesion between the copper layer and the dielectric layer, and poor thermal reliability performance.

In the manufacturing process of printed circuit boards, a key issue is to achieve reliable interconnection between layers through certain means. In addition to the process of using mechanical drilling and copper plating to process conductive through-holes, with the development of high-density interconnection technology, laser processing of blind holes followed by copper plating has also been widely used. In the layout of blind holes, both staggered hole design and stacked micro via pcb design can be used. Due to the use of stacked micro holes to save wiring space and reduce electromagnetic interference during high-frequency transmission, it is currently the conduction method used in high-end high-density printed circuit board products.

The method of using electroplating to fill blind holes to achieve the stacking of blind holes has become the most ideal filling method due to its high reliability and simple process. The production technology of second-stage or multi-stage HDI mostly uses laser drilling blind holes and electroplating blind hole filling to achieve interconnection between layers. The production difficulties lie in blind hole processing, electroplating blind hole filling, and control of alignment accuracy.

The advantages of the boards are mainly two aspects. One of them is the ability to achieve greater circuit density, that is, to achieve more circuits in a limited space. The circuit layers in the stacked micro via printed circuit boards are connected through perforations, allowing for more circuit layouts in a smaller area. The second is to achieve better signal transmission performance. In the printed circuit boards, signals can be freely transmitted between circuit layers, thereby reducing the loss and interference of signal transmission.

Stacked micro via pcb is a complex type of printed circuit board that can achieve higher circuit density and better signal transmission performance. Widely used in modern electronic products, it provides critical support for the functionality and performance of electronic products.

Picture: The section of sample board

The specification of sample board

Item:Stacked micro via pcb

Layer:8

Board thickness:1.6±0.16mm

Characteristic:2-stage laser drilling, stacked micro via

Hot Tags: stacked micro via pcb, China stacked micro via pcb manufacturers, suppliers, factory, high reliability pcb, high-reliability Printed Circuit Board, correspondence circuit board, Yellow PCB Board, Metal Half-hole Plate, Metal half hole pcb