Knowledge

Solderability of circuit boards refers to whether the surface of the circuit board is well compatible with welding materials and processes. There are many factors that affect the solderability of circ

We all know that without copper in the hole, it is impossible to conduct electricity, which must be avoided in circuit board manufacturing. There are many types of situations that can cause copper to

Burrs usually occur in processes such as circuit board cutting and punching. When cutting, the cutting tool will wear the copper foil to a certain extent when passing through the copper foil layer, re

With the development of electronic technology, the degree of integration of electronic products is becoming higher and higher, the structure is becoming more and more delicate, and the manufacturing p

Wave soldering is the process of directly contacting the welding surface of the plug-in board with high-temperature liquid tin, achieving the purpose of welding. The high-temperature liquid tin mainta

PCB blasting refers to blistering of copper foil, blistering of board, delamination or dip welding, wave soldering, reflow soldering, etc. on finished PCB due to thermal or mechanical action during PC

The effectiveness of oil removal directly affects the quality of film formation. Poor oil removal results in uneven film thickness. On the one hand, the concentration can be controlled within the proc

Ink is one of the important factors affecting the quality of circuit boards, and poor quality ink is also one of the reasons for the detachment of soldering green oil on circuit boards. Let's take a l

The lamination of multi-layer pcb is one of the commonly used production processes in the modern electronics industry, which can enable printed circuit boards to achieve higher electronic performance.

When producing printed circuit boards, there is often a problem of pressing bubbles. These bubbles can cause the quality of the pcb to not meet the requirements, affecting the reliability and stabilit

DIP, the abbreviation of dual inline-pin package, is a commonly used packaging technology for electronic components. It is the process of inserting component pins into a plug-in socket and connecting

SMT is known as Surface Mount Technology, which is currently the most popular technology and process in the electronic assembly industry. It has extremely high application value in production. SMT tec