3 Stage Laser Via HDI Board

Introducing the 3 Stage Laser Via HDI Board: The Next Level in PCB Technology

Are you tired of unreliable printed circuit boards that fail to meet your requirements despite their high cost? If so, then look no further than the 3 Stage Laser Via HDI Board.

Manufactured in our state-of-the-art facilities in China, the 3 Stage Laser Via HDI Board is the latest and most advanced PCB in the market today. It is designed to meet the rigorous demands of modern electronic devices used in high-tech industries such as aerospace, defense, healthcare, and industrial automation.

What makes our PCB different from others in the market is its three-stage laser drilling technology combined with High-Density Interconnection (HDI) design. This technology provides a more robust and reliable PCB that can handle fast data transmission, high-frequency signals, and high-quality power supply, all while reducing electromagnetic interference.

The board's three-stage laser drilling technology allows for the creation of smaller vias with better accuracy and control. This, in turn, produces a more compact board design with excellent signal integrity, better impedance control, and lower signal losses. Additionally, this technology provides higher connection density, which means that our PCB can accommodate more components on the board without sacrificing performance.

The HDI design is another feature that sets our board apart. HDI is a technique that involves stacking multiple layers of circuitry onto a single board, resulting in a more compact and efficient design. This allows us to produce quality PCBs with fewer layers, which in turn reduces overall cost and improves reliability.

The 3 Stage Laser Via HDI Board offers the ultimate combination of high-quality design, accuracy, and durability. It is meticulously engineered to cater to the most demanding applications while maintaining cost-effectiveness for our customers. Our engineers have fine-tuned the manufacturing process to ensure that each board meets the highest quality standards and can withstand the toughest conditions.

The board comes with various size options and customizations to cater to your specific needs. We produce a wide range of boards with thicknesses that vary from 0.2mm to 6mm and sizes up to 610mm x 1220mm. We also provide customization services to accommodate unique design specifications, 2-4-layer blind and buried via, and heavy copper requirements.

Our PCBs come with an ISO-9001 certification, which guarantees that they meet the highest industry standards for consistency and quality. Our manufacturing process is certified under ISO-14001, which ensures that our products meet environmental standards.

We take pride in our commitment to delivering quality products, and our customer-centric approach means we are always on hand to offer support and advice to our clients.

In summary, the 3 Stage Laser Via HDI Board offers a giant leap forward in PCB technology, providing our clients with unmatched accuracy, reliability, and performance. With our dedication to quality and customer support, our clients can rest assured that their PCB requirements will be met with the highest standards.

Contact us today to learn more about our products, pricing, and services. We look forward to doing business with you.

HDI is referred to as High density interconnection for short. On the circuit board in the first order, second order, third order, simply refers to the number of pressing. The 3 stage laser via HDI board indicates that the pressing times are 3, and the highly interconnected circuit board drilled by laser is used.

Characteristics of HDI board

1. Highly interconnected

2. For non-mechanical drilling, use laser drilling

3. The ring of micro-blind hole is below 6mil

4. The width/thinness of the wiring line between the inner and outer layers shall be below 4mil, and the diameter of the pad shall be no more than 0.35mm. 

The difficulty of such high-precision board is positively related to the number of layers and stages. The higher the number of layers and stages, the greater the difficulty.

At present, our company has mastered the first to third stage HDI production technology and can provide mass production services. Stage 3 or above belongs to the R&D trial stage.

Item: 3 stage laser via HDI board Key point: 3 stage laser via,Resin plugged

Technical Capacity

Why choose us?

• Our team of experts produces HDI Circuit Boards that are second-to-none.
• Our 3 Stage Laser Via HDI Board positioning in the high-end, never shoddy, because we pursue high-quality customers, to bring customers the best experience.
• We are always looking for ways to improve our manufacturing processes and deliver better HDI Circuit Boards to our customers.
• We keep developing new products, competing in domestic and international markets with independent intellectual property rights, and enhancing the core competitiveness of our enterprise.
• We are a reliable supplier and manufacturer with competitive pricing.
• We sincerely invite people of insight from all over the world to accept the advanced technology.
• Our team is committed to exceeding our customers' expectations when it comes to service and quality.
• We always adhere to the service concept of serving customers with integrity and winning the market with our brand.
• We are always happy to provide samples of our HDI Circuit Boards so customers can evaluate their quality.
• As China's market economy gradually integrates with the international market, we will inspire our spirits, seize opportunities, and meet challenges, always put the interests of users first, and continue to develop and update products to meet the new era's demand for high-tech instrument products. , Carefully, carefully, and attentively provide users with superior cost-effective products.

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