Problems in the manufacturing method of embedded copper PCB

In terms of pressing of buried copper bar, due to the limitation of design accuracy, there is a certain difference between the thickness of buried copper bar and PCB board (such as height deviation or tolerance required by customers), which makes the edge of buried copper block form a step with PCB board. Due to the existence of this kind of step, there is glue overflow at the step position during pressing.

At present, abrasive belt is generally used for polishing to remove resin adhesive, but due to the unevenness of the step position, the resin at the step position cannot be effectively removed. If the resin adhesive is effectively removed by adding more abrasive belt grinding times, the PCB board will face the problem of exposing the substrate.

In terms of pressing of embedded copper block, in order to ensure the compactness of pressing, the size of embedded copper block is generally slightly larger than the position of PCB slot in the design process of embedded copper block, and according to this, the copper block can not be effectively positioned and is easy to be offset because the size of copper block is larger than that of PCB slot when punching the copper block into PCB slot. And the punching equipment can not apply pressure evenly, which is easy to cause damage to the PCB board, and can only be used for sample production.

In addition, if the copper block is offset and pre-sized too much during the embedding process, the gap between the copper block and the PCB slot will be different in size. During the subsequent resistance welding, it is impossible to plug the fine holes, which is easy to hide bubbles, affecting the product quality, and also increasing the production risk of the enterprise.