Description of Electro gold plating
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Aim and function: As a precious metal, gold has the advantages of good weldability, oxidation resistance, corrosion resistance, low contact resistance, and good wear resistance of alloy.
Electro gold plating:By electroplating, the gold particles are attached to the PCB. All of them are called electrogold, which is also called hard gold because of its strong adhesion. The gold fingers of the memory module are hard gold, which is wear-resistant. The bound pcb also generally uses electrogold or nickel palladium gold.
Immersion gold:Through chemical reactions, the gold particles crystallize and adhere to the pcb pad. Because of the weak adhesion, it is also called soft gold.
Through chemical reaction, the gold particle crystal will attach to the bonding pad of the pcb. Because of the weak adhesion, it is also called soft gold.
Gold thickness of the immersion gold PCB usually ≤ 0.10um (0.025-0.10um)
Gold thickness of electro gold plating PCB usually ≥0.20um (0.20-3.00um)
Type of electro gold plating board
Long and short golden fingers+beveled edges
Segmented golden finger+bevel edges
Local Electro gold plating of board pattern - Bonding/welding
Etching lead after Electro gold plating of whole board
