The Introduction Of Anylayer High Density Interconnection
Jan 05, 2023
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Characteristics
1.The core board is thin, generally within 0.1mm.
2.High wiring density
3.The distribution of hole layer is complicated
4.Long production process
5.Line widith/spacing is smal:50/50um-100/100um
Processing capability of Anylayer HDI laser drilling
|
Item |
maximum |
Normal |
minimum |
|
A Upper hole diameters |
0.125mm |
0.1mm |
0.075mm |
|
B Lower hole diameters |
0.1mm |
0.085mm |
0.06mm |
|
B/A Upper and lower hole diameters |
90% |
80% |
70% |
|
C Dielectric layer |
0.1mm |
0.06mm |
0.04mm |
|
C/A Thickness diameter ratio |
1:1 |
0.6:1 |
/ |
