Knowledge

HDI is the abbreviation of High Density Interconnector, which is a (technology) for the production of printed circuit boards. HDI is a compact product designed for small volume users.

The characteristics of the rigid-flex board determine that its application field covers all the application fields of FPC to PCB, such as: Mobile phone Keypad and side buttons, etc. Computer and LCD s

Advantages: The rigid-flex board has both the characteristics of FPC and the characteristics of PCB. Therefore, it can be used in some products with special requirements. It has both a certain flexibl

Because the flex-rigid board is a combination of FPC and PCB, the production of flex-rigid board should have both FPC production equipment and PCB production equipment. First, the electronic engineer

The birth and development of FPC and PCB gave birth to the new product of flexible and rigid board. Therefore, the flexible and rigid board is a flexible circuit board and a rigid circuit board, which

Aluminum substrates can be divided into: tin-sprayed aluminum substrates, anti-alumina substrates, silver-plated aluminum substrates, immersion gold aluminum substrates, etc. according to the process;

Aluminum substrate use: power hybrid IC (HIC). Audio equipment Input, output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc. power supply Switching regulators,

Aluminum substrate (metal-based heat sink (including aluminum substrate, copper substrate, iron substrate)) is a low-alloyed Al-Mg-Si series high-plastic alloy plate (see the figure below for the stru

Circuit Layer The circuit layer (generally using electrolytic copper foil) is etched to form a printed circuit for assembly and connection of devices. Compared with the traditional FR-4, with the same

The surface of the power device is mounted on the circuit layer. The heat generated by the device is quickly conducted to the metal base layer through the insulating layer, and then the heat is transf

Aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single-sided panel consists of three-layer structure, which are circuit layer (copper foil),

Aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single-sided panel consists of three-layer structure, which are circuit layer (copper foil),