The working principle of aluminum substrate

The surface of the power device is mounted on the circuit layer. The heat generated by the device is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred out by the metal base layer, so as to realize the heat dissipation of the device.

Compared with the traditional FR-4, the aluminum substrate can reduce the thermal resistance to a minimum, so that the aluminum substrate has excellent thermal conductivity; compared with the thick film ceramic circuit, its mechanical properties are extremely excellent.

In addition, the aluminum substrate has the following unique advantages:

Compliant with RoHS requirements;

More suitable for SMT process;

Extremely effective treatment of thermal diffusion in circuit design schemes, thereby reducing module operating temperature, extending service life, and improving power density and reliability;

Reduce the assembly of heat sinks and other hardware (including thermal interface materials), reduce product volume, and reduce hardware and assembly costs; optimize the combination of power circuits and control circuits;

Replacing fragile ceramic substrates for better mechanical durability.