Copper exposure on the printed circuit board

Printed circuit boards are a very important component in electronic products and also the core carrier for making circuits. When making circuit boards, there may be scratches and copper exposure issues, which can have a serious impact on the performance and reliability of the circuit. Therefore, it is very necessary to take corresponding measures in a timely manner to avoid the occurrence of scratches and copper exposure issues.

 

The main issue with copper exposure caused by scratches on printed circuit boards is the surface of the printed circuit board, which exposes the underlying copper layer. Based on experience, this type of problem often occurs for the following reasons.

 

Firstly, damage caused during transportation. Because the circuit board is fragile, it needs to be handled carefully during the whole manufacturing process. However, during the transportation process, the circuit board may be damaged by extrusion, collision and so on due to poor packaging and inappropriate transportation mode, resulting in scratches.

 

Secondly, the manufacturing process is not standardized. Manufacturing printed circuit boards requires multiple processes and strict control during the operation process. Whether it is human or machine operation errors, we need to strictly manage them. If the operation is improper or the manufacturing process is not standardized, it can cause scratches on the circuit board.

 

Thirdly, the quality of raw materials is not up to standard. The materials of circuit boards generally include base plates, copper foil, chemical materials, etc. If the quality of these raw materials is not up to standard, it may also cause scratches on the circuit board.

 

How to avoid the problem of scratches and exposed copper on circuit boards?

 

The packaging and transportation of circuit boards are very important during the manufacturing process. Especially for bulk packaging of a large number of circuit boards, professional packaging forms with different materials should be used to ensure that the circuit boards receive the best protection. Secondly, during the manufacturing process, each process should be inspected one by one to ensure that the manufacturing process is executed in a standardized manner. At the same time, a detailed inspection should be conducted from the selection of raw materials to their use to ensure that the quality of the materials meets the requirements.

 

The problem of scratches and exposed copper on circuit boards exists, but as long as the manufacturing process is strictly controlled and corresponding preventive measures are taken, this problem can be avoided. Therefore, when manufacturing circuit boards, it is important to attach great importance to this issue and ensure that the circuit boards can be produced perfectly.

 

 

 

Sihui Fuji adheres to all standards, and we have developed strict operating procedures and continuously trained employees to operate according to standardized procedures, reducing the occurrence of substrate scratches and copper leakage during the production process.