Causes And Solutions Of Poor Tin On The Immersion Gold PCB

The Immersion gold PCB is currently the most widely used type of material, it can be used not only in construction, but also in the manufacture of auto parts, electronic components and other fields. In the electronic manufacturing industry, tinning on the Immersion gold PCB is a very important process. Tin on the Immersion gold PCB can improve the quality and performance of electronic components, and ensure the reliability and stability of electronic products. However, sometimes there will be poor phenomena in the process of tinning the Immersion gold PCB, it will cause the quality of the manufactured electronic components to fail to meet the standard. So, what are the reasons and solutions for the bad tin on the Immersion gold PCB?

reason

Not cleaning properly: Proper cleaning is the key to tinning on the Immersion gold PCB. If it is not cleaned thoroughly, the oil and impurities on the surface of the Immersion gold PCB will hinder the adsorption and diffusion of tin, resulting in uneven tin layer.

Metal oxidation: The metal oxidation on the surface of the Immersion gold PCB will affect the adsorption and diffusion of tin. Therefore, it is necessary to carry out appropriate reduction treatment on the Immersion gold PCB.

Uneven temperature: Uneven temperature will lead to uneven diffusion of tin, it will affect the quality of tin on the Immersion gold PCB.

The quality of tin material is not good: if the quality of tin material is poor, the effect of tin on the Immersion gold PCB will not be good.

Solution

Thorough cleaning, choose the appropriate cleaning agent and cleaning process, thoroughly clean the oil and impurities on the surface of the Immersion gold PCB, to ensure that the surface of the Immersion gold PCB is clean and free of impurities.

Carry out appropriate reduction treatment: a reducing agent can be used to perform appropriate reduction treatment to remove the metal oxide on the surface of the Immersion gold PCB.

Adjust the welding temperature and time to improve the quality of solder joints. After confirming the welding temperature and time, conduct tests and inspections many times to ensure that the welding is up to standard.

Use suitable solder paste to improve the quality of solder joints. For components that are easily anodized, lead-free solder paste is recommended. For components that are not easily oxidized, conventional lead solder paste can be used.

To sum up, the reasons for poor tin on the Immersion gold PCB are mainly due to factors such as failure to perform thorough cleaning, metal oxidation, uneven temperature, and poor quality of tin material. Using appropriate measures and processes, thoroughly cleaning the gold plate, performing reduction treatment, strengthening temperature control, and selecting good tin materials can effectively solve the problem of poor tin on the Immersion gold PCB. Only in this way can the quality and stability of tin on the gold plate be guaranteed, and finally high-quality electronic components can be manufactured.