Wafer Testing Printed Circuit Board

Wafer testing printed circuit boards are an important type of electronic components used for semiconductor wafer testing. It is a specialized board used for electronic component testing, mainly used in wafer testing and other occasions.

Wafer testing equipment can test various types of semiconductor devices, such as integrated circuits, memory modules, etc. They can also conduct various tests, such as electrical testing, functional testing, etc., to ensure that the performance of components meets standards and requirements.

Due to the importance of wafer testing, wafer testing printed circuit boards are often considered a crucial electronic component. Therefore, in the design and manufacturing process, it is necessary to adhere to high-precision and high reliability standards and requirements to ensure their long-term stable operation, thereby providing strong support for the modern electronic industry.

Wafer testing printed circuit board is a type of circuit board used for semiconductor wafer testing, which has the following characteristics:

1. High density wiring: Wafer testing printed circuit boards need to carry a large number of circuit components, and the distance between circuit components is very close, so high-density wiring is required.

2. High speed transmission: The board needs to support high-speed transmission in order to quickly test the wafer.

3. High reliability: As the wafer testing pcb carries the task of testing the wafer, its reliability requirements are very high and no faults are allowed.

Due to the high reliability and stability of wafer testing boards, they are mainly used in the semiconductor production field and can be used to test various chip products, including microprocessors, memories, and programmable logic. Its application can enable chip manufacturers to better grasp the quality and performance of chips, and improve the competitiveness of products.

Sihui Fuji successfully made a 34 layers blind hole wafer testing board. The total board thickness is controlled according to 4.75 ± 0.254mm, and the blind hole diameter isφ0.175mm. Laser hole isφ0.10mm. Minimum through hole drill bit is 0.30mm. Board thickness to diameter ratio is 15.83:1. In the production of this high, multi-layer and complex wafer testing board, we have strictly controlled the shrinkage values of pressing, drilling accuracy, and hole copper thickness to ensure the quality of the board.

Wafer testing printed circuit boards are one of the indispensable and important components in the modern electronic industry, and their successful design and manufacturing are of great significance for ensuring the correctness and consistency of semiconductor devices.

Picture:Wafer testing printed circuit board

The specification of sample board

Item:Wafer testing printed circuit board

Layer:34

Material:370HR

Board thickness:4.75±0.254mm

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